Capabilities

General PCB Capabilities
HLC
HDI
FPC&Rigid-Flex
IMS PCB
Layer Count
1-24
4-16
FPC:1-6
 Rigid-Flex:2-12
1-2
Board Thickness(mm)
0.3-3.4
0.27-3.2
FPC:0.05-1.0
  Rigid-Flex:0.27-3.2
1.6 (63) - Typical                 3.2 (126) - Max.                     0.8 (32) - Min.
Min.Dielectric Thickness(mm)
0.045
0.03
0.05
0.05
Max.Panel Size(mm×mm)
724 (28.5") x 622 (24.5")
610 (24")×475(18.7")
FPC: 250 (9.2") x 1500(59.1")                  Rigid: 545(21.5")×622(24.5")
520(20.5") x 610 (24.0")
Base Copper Thickness(oz)
1/3-6
1/3-4
FPC:1/3-2
 Rigid-Flex:1/3-4
/
Hole-wall Copper Thickness(µm)
20-70
20/18,  25/20
20/25
20/25
Outer Layer Finished Copper Thickness(oz)
1-5
1-2
1-2
1-2
Laminate Supplier
Rogers,Panasonic,Nelco,TUC,Isola,ITEQ,SYTECH,Nanya,Taconic、EMC、DOOSAN、Wazam、CCTC,NOUYA
SYTECH,TAIFLEX,ThinFlex
Wazam,Ventec,ITEQ,SYTECH,RISHO
Laminate Type
CME-1, CEM-3, High-CTI,Unleaded(Mid、High-Tg),Halogen Free,High frequency(hydrocarbon、PTFE),High Speed(mid. loss、low loss、very low loss,ultra low loss), PI, LCP
Copper Base,Aluminum Base
Min.line width/space (inner layer)(mm)
0.05/0.05
0.05/0.05
FPC:0.04/0.04
 Rigid-Flex:0.05/0.05
/
Min.line width/space (outer layer)(mm)
0.05/0.05
0.05/0.05
FPC:0.04/0.04
 Rigid-Flex:0.05/0.05
0.10/0.10
Line width tolerance(mm)
+/-20%(Typical)                       +/-10%(Advanced)
+/-20%(Typical)                       +/-10%(Advanced)
+/-20%(Typical)                       +/-10%(Advanced)
+/-20%(Typical)                       +/-10%(Advanced)
Layer to layer registration(mil)
5
5
5
5
Impedance(%)
8
8
8
/
Mechanical drill diameter(mm)
≥0.15
≥0.15
≥0.15
1-6
Laser hole diameter(mm)
≥0.075
≥0.075
≥0.075
/
Max.Aspect ratio (PTH)
14:1
14:1
14:1
4:1
Max.Aspect ratio (Microvia)
/
1:1
1:1
/
Backdrill depth tolerance(mil)
±3
±3
±3
±4
Max.Warpage(%)
0.50
0.50
0.50
0.50
Signal Integrity
SET2DIL/Delta-L/VNA
/
Surface Finish
HASL-LF,HASL,Electroless Nickel/Immersion Gold,Immersion Tin,OSP,Immersion Silver,Gold Finger,Selective OSP
HASL-LF,Electroless Nickel/Immersion Gold,OSP
Structure
Through hole
5+N+5
Anylayer
Common Symmetrical structure,Symmetrical structure HDI
/
Air-gap Structure
Asymmetric structure,HDI
Special Product
Embedded PCB
Embedded parallel capacitor、Embedded daughter board
/
Step PCB
PTH slot,NPTH slot,Step G/F., ect.
/
Heat dissipation PCB
IMS,Embedded Cu,Embedded Coin、Embedded Ceramic、Conductive Adhesive、High Thermal Dissipation Material ., ect.
/
High density PCB
1mm pitch BGA with backdrill (2 tracks),8mil PTH with backdrill (D+6mil),0.35mm pitch BGA HDI., ect.
/
Other Special Process
POFV(VIPPO ), Hybrid, Partial Hybrid, Variable Length G/F, Stepped G/F, Segmented G/F, Edge Plating, N+N, Partial Plating,Semi-flex., ect.
 

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